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  6. 3M™ Electrically Conductive Adhesive Transfer Tape 9712, 609.6 mm x 32.9 m, 50.8 µm

3M™ Electrically Conductive Adhesive Transfer Tape 9712, 609.6 mm x 32.9 m, 50.8 µm

  • 3M ID 7100245757

Slightly thicker adhesive than Tape 9713

Isotropic XYZ-axis electrical connectivity

Uses non-woven carbon scrim that usually leads to higher surface contact resistance than Tape 9713

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Detaily

Zvýraznenie
  • Slightly thicker adhesive than Tape 9713
  • Isotropic XYZ-axis electrical connectivity
  • Uses non-woven carbon scrim that usually leads to higher surface contact resistance than Tape 9713
  • Good contact with both hard and soft surfaces
  • Excellent die-cutting and converting capabilities

3M™ Electrically Conductive Adhesive Transfer Tape 9712 is an XYZ-axis electrically conductive pressure sensitive adhesive (CPSA) tape. This double-sided tape has a conductive carbon scrim carrier. Designed for EMI shielding and grounding applications, enabling devices to meet electromagnetic compatibility requirements.

3M™ Electrically Conductive Adhesive Transfer Tape 9712 has a good balance of adhesion and conductivity, which is optimal for larger contact areas where high electrical conductivity is not required. This tape provides excellent workability and easy handling. This tape has non-metallic product construction for specialty applications. It provides robust protection against EMI in a range of market segments such as consumer electronics, automotive, medical devices, communication infrastructure, and aerospace & defense electronics.


Recommended Applications:
PCB/flex/chassis grounding
Bond line gap shielding
Electrostatic discharge (ESD)
EMI shield & gasket attachment


From simple to complex designs, our family of shielding and grounding solutions provides protection against EMI. Our solutions provide excellent adhesion to a variety of substrates including metals and plastics. These tapes are easy to apply using low pressure without heat, enhancing productivity. We have multiple thicknesses available to meet even the most space constrained and complex design requirements.

Špecifikácie

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